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Redfern Partners Increases Focus on Acquisitions

Insulectro Names Patrick Redfern President


Patrick Redfern, President


Tim Redfern, Managing Director

Redfern Partners, LLC

      Effective December 7, 2015, Patrick Redfern becomes President of Insulectro succeeding Tim Redfern who held the position for twelve years. Patrick began his professional career at Insulectro in 1998 and has also held key executive positions at LCOA and CAC. He is a graduate of the University of Southern California. He graduated with a Bachelors Degree in Business Administration with an emphasis in Entrepreneurship.

     "I am excited to continue the successful formula Insulectro has defined and implemented over the years –  best-in-class suppliers, top products, geographically-diverse stocking locations in North America, and a customer-centric Service Model,” Patrick stated.

     “We will continue to focus on our execution and the needs of our customers, our customers’ customers, and our suppliers,” Patrick concluded.

     Tim Redfern commented, “I am looking forward to seeing the value that Patrick’s fresh perspective will bring to this role. Not only is he is an experienced executive, but he knows our business, understands the market, and the requirements of our customers and suppliers.”

     Tim Redfern will become Managing Director of Redfern Partners, LLC where he will lead the efforts to identify and integrate strategic acquisitions that will utilize Insulectro’s and the other Redfern Companies’ capabilities and resources. Additionally, he will take on more responsibility for the management of the Redfern Companies’ assets and investments, inside and outside of the electronics industry.

     He will remain engaged with Insulectro’s customers and suppliers in addition to remaining an officer and member of the Board of Directors. Tim began his career at Insulectro in 1992 in sales and has held a variety of management roles until assuming the top position twelve years ago.

     “Insulectro has a long history of acquisition as a growth strategy. Sometimes that growth has come from acquiring whole companies, other times from adding products to our offering. Acquisitions that more fully utilize our capabilities are a priority for the Companies.

     “With our newly implemented Oracle®-based ERP system and our geographical presence throughout North America, we have a solid platform of resources, corporate infrastructure, and IT capabilities to leverage and create new opportunities,” Tim Redfern stated.

     Insulectro has been in the news many times this year for introducing new products for high-speed digital, rf/microwave, drill room, and flexible film applications. Earlier, Insulectro announced its foray in Printed Electronics as a single source distributor of inks, substrates, and consumables.



Read Press Release.

Setting the pace with
tomorrow's innovations.
Insulectro is dedicated to shaping the direction of our industry

INSULECTRO is the leading supplier of materials used to manufacture printed circuit boards (PCBs) and printed electronics (PEs). Insulectro combines its     Best-in-Class product offering in well-stocked distribution centers across the country.

Our offering is supported by our extensive fabrication capabilities, legendary customer service and a staff of knowledgeable technical resources.

Insulectro serves a broad customer base manufacturing rigid, rigid/flex and flexible circuit boards for applications in a variety of end markets including telecom, data communications, high speed computing, mobile devices, military,  and medical.




Things we are excited about. . .


Insulectro, a leading supplier of materials for use in the PCB and printed electronics industries, announced a breakthrough partnership to supply world-class performance copper foils manufactured by Oak-Mitsui throughout North America.


Beginning in July, Insulectro will provide copper foil manufactured by Oak-Mitsui for the PCB outer-layer market requirements. This strategic move will provide long-term sustainable domestic foil to PCB fabrication customers.


In addition, CAC, Inc. will now manufacture its CAC (Copper-Aluminum- Copper) bonded product with Oak-Mitsui copper Foil. CAC products will continue to be distributed through its global distribution partners, including Insulectro.


“I am proud to announce the addition of Oak-Mitsui copper foil to the Insulectro family of high performance materials. Oak-Mitsui is a globally recognized leader in copper foils to the electronics industry and this partnership provides our customers domestically produced products with a more reliable supply chain,” announced Insulectro CEO Tim Redfern. “We will offer Oak-Mitsui’s entire copper product portfolio – from ultra-thin foils to specialty treatments – for today’s challenging adhesion applications. I’m sure our customers will appreciate the net effect of this deal – we’re bringing the highest quality copper to our customers utilizing our US network of ten stocking locations.”

Read more.

Insulectro, a leading supplier of materials for use in the PCB and Printed Electronics industries, is distributing six new products that are virtually without competition in the PCB marketplace.


The products, which range from laminates to drill room materials, symbolize how PCB suppliers are keeping up with the OEM demands of thinner, faster, better.


“What we are seeing coming into the marketplace are materials that are focused on eliminating or reducing certain challenges fabricators have had to put up with, as well as new ones caused by rapidly evolving technology,” commented Insulectro Vice President of Technology Chris Hunrath. “It’s remarkable to have a portfolio of six performance products that are without peer in our industry.”


Vice President of Product Management Jason Marsh agrees with Hunrath. “On one side of the perspective, we are offering Isola’s new laminate Chronon™ with its electrically transparent glass fiber reinforcement that eliminates differential pair skew issues for next generation High Speed Digital designs that operate about 10 GHz. On the other side, we’re introducing LCOA’s new conformal drill layer – Conformat™– that is soft enough to overcome image transfer challenges, yet hard enough to suppress exit side burrs in the drilling process,” Marsh stated. “Both products have been met with unprecedented enthusiasm.”


Hunrath added, “Plus, DuPont’s new Pyralux® HT is a laminate system with a service temperature of 225 degrees C. for flexible and rigid PCB applications. HT allows board shops to fabricate previously impossible designs for automotive, aerospace, oilfield, and other high temperature environments.


“Also taking the heat are two new products from Pacothane – ThermoPad™ and ThermoFilm™ – a press pad and film that utilizes a unique release technology for temperatures up to 300 degrees C. allowing reliable lamination and unmatched conformability of the latest generation of high temperature materials,” he concluded.


Other products include Ormet Sintering Paste which is a Z-axis interconnect paste that forms a metallurgical bond between layers and facilitates both rapid time to market and high complexity boards. Also, a polyimide silver paste is just about to come on the market.


 “Insulectro’s Six Pack Performance Products are very exciting for our customers. They will help shape our industry in the near future,” commented Ken Parent, Insulectro Vice President of Sales. “OEMs will be delighted to see how these materials can deliver results not before imagined.”




With a splash and a bang, Insulectro rolled out several new products for both the PCB materials market and for the Printed Electronics market at this year’s IPC APEX EXPO at the San Diego Convention Center, February 24 through 26, 2015. The reaction was overwhelming as high numbers of attendees crowded Insulectro's booth to learn about new products.

Insulectro Vice President of Product Management Jason Marsh commented, “We knew we had a great array of new things to talk about but we underestimated the amount of interest. Circuit boards are continuing the relentless trend towards thinner, smaller, and faster. OEM designers are demanding a new breed of materials with lower loss and lower Dk to design and build boards that were never before possible. At APEX EXPO, we introduced a host of exciting products from DuPont®, Isola, LCOA®, Ormet, and Pacothane.”

Marsh added, “We excited to be bringing new high performance products in the High Speed Digital and RF Microwave laminate landscape and well as in the thin dielectric films and sintering paste arenas to facilitate next generation designs.  A lot of fabricators were interested, too, in breakthrough solutions to challenges in backdrilling, conformal backup, high aspect ratio drilling, imaging, and even new additive solutions in our printed electronics portfolio – to name a few.”

Another highlight of the three-day show occurred when the California Legislative Delegation met with Insulectro execs to discuss the importance of the electronics industry to our state.



As part of its continued focus on the Silicon Valley marketplace, Insulectro has rolled out a special PumaFast™ delivery van to compliment its service model for qualified customers' needs. The Sprinter Model 170 van will offer premium, ultra-fast delivery to facilitate customers' QuickTurn needs.

RESEARCH TRIANGLE PARK, N.C. and LAKE FOREST, Calif., Aug. 24, 2014  — DuPont Microcircuit Materials (DuPont) and Insulectro recently signed an agreement that allows Insulectro to distribute DuPont polymer thick film paste products to U.S. customers in the thin film photovoltaic, printed circuit board, smart card and membrane touch switch markets.  The collaboration allows DuPont to focus on further development and expansion of its printed electronics product portfolio, and leverages the extensive relationships Insulectro has established with key accounts in the printed electronics industry.  Within the last year, DuPont Microcircuit Materials has expanded its printed electronics offering with a line of low-silver conductive inks designed to enable cost savings for a broad range of applications, including membrane touch switch (MTS), radio-frequency identification (RFID), and wearable electronic applications.


Speed Matters

Our industry, our customers, and suppliers are positioned in the center of  technological acceleration. . New developments in PCB manufacturing processes are everywhere –new substrates, resins formulations, glass-cloth, copper foils, and glass-free builds.  Why the demand for these new breakthrough products? They make things faster. They all allow brand new designs to run with greater speed.


Game Changers

Isola's Chronon™ & Tachyon 100G

Two new products that mix it up in High Speed Digital


Chronon™ laminate and prepreg products have been engineered to mitigate/eliminate skew issues in 40 Gb/s or more designs that require more bandwidth, such as backplanes and line cards.


Chronon materials deliver the necessary thermal robustness for lead-free applications and for electrical (low loss) applications that require tighter control of loss and skew.


In addition, it delivers the necessary thermal robustness for lead-free applications and electrical bandwidth (low loss) for applications that require more stringent signal integrity.


It also has PCB designer-friendly advantages because the Dk and Df ratings are close enough in value that they can be considered constant for all of the specified cores and prepregs.


Chronon is a proprietary high-performance, 192°C glass transition temperature (Tg) system for multilayer Printed Wiring Board (PWB) applications where maximum thermal performance and reliability are required. Chronon products use spread glass and reduced profile copper to mitigate skew in differential pair designs.


The use of ultra-smooth cooper is enabled by very high adhesive bond between the resin and the metal. Chronon has a nominal dielectric constant (Dk) of 3.68 and a very low nominal dissipation factor (Df) of 0.0040. Both are stable between -55°C and +125°C up to 40 GHz.


Chronon laminate materials are available in optimized laminate and prepreg forms in typical thicknesses and standard panel sizes to provide a complete material solution for high-speed digital multilayer backplanes and daughter cards.


Key Features

    High Thermal Performance

  • Tg of 192°C  (TMA)
  • Td of 369°C (TGA)
  • Low CTE for reliability


    Standard Availability

  • Thicknesses: 0.002″ (0.05 mm) to 0.060″/0.062″ (1.5 mm)
  • Copper Foil Cladding: ½, 1 and 2 oz., standard HTE – Grade 3, RTF and VLP-2
  • Prepregs: Rolls or panels
  •  Glass Styles:Low Dk glass, square weave and spread glass fabrics available


     Industry Approvals

  • UL 94 V-0
  • UL Qualified: MOT 130
  • Non-ANSI
  • IPC-4103 /17


Tachyon 100G laminate materials are designed for very high-speed digital applications up to and beyond speeds of 100 Gb/s. Tachyon 100-G materials exhibit exceptional electrical properties that are very stable over a broad frequency and temperature range. Tachyon 100G is suitable for scaling current products to their next generation through design of new backplanes and daughter cards, enabling almost 10x improvements from 10 Gb/s data rates. Tachyon 100G targets line cards that require the highest thermal performance. It has identical electricals as Tachyon, but offers a 30% improvement in Z-axis CTEs on high-layer count PCBs. This makes it a perfect choice for higher layer line cards that have multiple 2 Oz. planes and BGAs with pitches at 0.8 mm or less.


Tachyon 100G products use spread glass and reduced profile copper to mitigate skew and improve rise times, reduce jitter, increase eye width and height. Use of ultra smooth cooper is enabled by very high adhesive bond between the resin and the metal. Tachyon 100G has a nominal dielectric constant (Dk) of 3.02 that is stable between -55°C and +125°C up to 40 GHz. In addition, Tachyon 100G offers a very low nominal dissipation factor (Df) of 0.0021. Tachyon 100G laminate materials are available in optimized laminate and prepreg forms in typical thicknesses and standard panel sizes to provide a complete material solution for high-speed digital multilayer backplanes and daughter cards.


Key Features

    Electrical Properties

  • Dk: 3.02
  • Df: 0.0021
  • Typical electrical properties over a broad frequency and temperature range per IPC-TM-650-


    High Thermal Performance

  • Tg of 200°C  (DMA)
  • Td of 360°C (TGA)
  • Low CTE in the Z-axis 2.5%  (50 to 260°C)


    Available in Laminate and Prepreg

  • Tachyon offers a complete laminate materials solution for double-sided, hybrid and multilayer printed circuit designs.


    Industry Approvals

  • Thicknesses: 0.002″ – 0.018″
  • Copper Foil Cladding: ½, 1 and 2 oz., VLP-2
  • Prepregs: Rolls or panels
  • Glass Styles: Tachyon offers the unique ability to use standard glass fabrics


    Standard Availability


  • IPC-4103 /17
  • UL Recognized: V-0
  • UL Qualified: 130 MOT
  • Non-ANSI


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