20362 Windrow Drive • Lake Forest, CA 92630 • (949) 587-3200

 

 

 

CUTTING-EDGE MATERIALS FROM THE WORLD'S MOST TRUSTED MANUFACTURERS

 

LAMINATES, PREPREG, FOILS, CHEMISTRY, COPPER, FLEX,  DRY FILM, BACKUP/ENTRY, HDI, SEPARATORS, FILMS, PADS, PASTES, INKS

 

Setting the pace with
tomorrow's innovations.
Insulectro is dedicated to shaping the direction of our industry

INSULECTRO is the leading supplier of materials used to manufacture printed circuit boards (PCBs) and printed electronics (PEs). Insulectro combines its     Best-in-Class product offering in well-stocked distribution centers across the country.

Our offering is supported by our extensive fabrication capabilities, legendary customer service and a staff of knowledgeable technical resources.

Insulectro serves a broad customer base manufacturing rigid, rigid/flex and flexible circuit boards for applications in a variety of end markets including telecom, data communications, high speed computing, mobile devices, military,  and medical.

 

INSULECTRO MAKES BIG IMPACT AT IPC APEX IN SAN DIEGO, FEBRUARY 24-26, WITH NEW PRODUCTS, INTERACTIVE DISPLAYS & QUICKTURN VEHICLE

 

 

Things we are excited about. . .

With a splash and a bang, Insulectro rolled out several new products for both the PCB materials market and for the Printed Electronics market at this year’s IPC APEX EXPO at the San Diego Convention Center, February 24 through 26, 2015. The reaction was overwhelming as high numbers of attendees crowded Insulectro's booth to learn about new products.

Insulectro Vice President of Product Management Jason Marsh commented, “We knew we had a great array of new things to talk about but we underestimated the amount of interest. Circuit boards are continuing the relentless trend towards thinner, smaller, and faster. OEM designers are demanding a new breed of materials with lower loss and lower Dk to design and build boards that were never before possible. At APEX EXPO, we introduced a host of exciting products from DuPont®, Isola, LCOA®, Ormet, and Pacothane.”

Marsh added, “We excited to be bringing new high performance products in the High Speed Digital and RF Microwave laminate landscape and well as in the thin dielectric films and sintering paste arenas to facilitate next generation designs.  A lot of fabricators were interested, too, in breakthrough solutions to challenges in backdrilling, conformal backup, high aspect ratio drilling, imaging, and even new additive solutions in our printed electronics portfolio – to name a few.”

Another highlight of the three-day show occurred when the California Legislative Delegation met with Insulectro execs to discuss the importance of the electronics industry to our state.

                                CLICK HERE FOR MORE ON IPC EXPO

 

INSULECTRO DEBUTS NEW QUICKTURN VEHICLE IN SILICON VALLEY

As part of its continued focus on the Silicon Valley marketplace, Insulectro has rolled out a special PumaFast™ delivery van to compliment its service model for qualified customers' needs. The Sprinter Model 170 van will offer premium, ultra-fast delivery to facilitate customers' QuickTurn needs.

RESEARCH TRIANGLE PARK, N.C. and LAKE FOREST, Calif., Aug. 24, 2014  — DuPont Microcircuit Materials (DuPont) and Insulectro recently signed an agreement that allows Insulectro to distribute DuPont polymer thick film paste products to U.S. customers in the thin film photovoltaic, printed circuit board, smart card and membrane touch switch markets.  The collaboration allows DuPont to focus on further development and expansion of its printed electronics product portfolio, and leverages the extensive relationships Insulectro has established with key accounts in the printed electronics industry.  Within the last year, DuPont Microcircuit Materials has expanded its printed electronics offering with a line of low-silver conductive inks designed to enable cost savings for a broad range of applications, including membrane touch switch (MTS), radio-frequency identification (RFID), and wearable electronic applications.

INSULECTRO INKS DEAL WITH DUPONT TO DISTRIBUTE ITS EXCLUSIVE MCM CONDUCTIVE INKS - FOCUS ON PRINTED ELECTRONICS INDUSTRY HEATS UP

ISOLA OFFERS CONVERSION SERVICE FOR RF/MICROWAVE FABRICATORS

CHANDLER, Ariz., July 17, 2014 — Isola Group, a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer printed circuit boards (PCBs), today announced that its technical staff would offer a conversion service for PCB fabricators of radio frequency (RF) and millimeter-wave applications. This global 24-hour design review service will enable PCB fabricators to quickly and cost-effectively transition their current RF substrates to Isola’s RF products and eliminate the production backlogs caused by the current shortages of RF substrates. The company also announced that it has increased production of its RF-related materials; Isola’s materials are in stock and ready to ship – unlike other laminate suppliers that have extended their lead-times to as long as 12 weeks.

Speed Matters

Our industry, our customers, and suppliers are positioned in the center of  technological acceleration. . New developments in PCB manufacturing processes are everywhere –new substrates, resins formulations, glass-cloth, copper foils, and glass-free builds.  Why the demand for these new breakthrough products? They make things faster. They all allow brand new designs to run with greater speed.

PRODUCT SPOTLIGHT

I-Tera or Interra ?

Only the names are alike. . .

One by DuPont, One by Isola – Two superior products you should know about.

ISOLA I-TERA® MT

I-Tera® MT laminate materials exhibit exceptional electrical properties which are very stable over a broad frequency and temperature range.

 

I-Tera® MT is suitable for many of today’s high speed digital and RF/microwave printed circuit designs. I-Tera MT features a dielectric constant (Dk) that is stable between -55°C and +125°C up to 20 GHz. In addition, I-Tera MT offers a lower dissipation factor (Df) of 0.0036 making it a cost effective alternative to PTFE and other commercial microwave and high-speed digital laminate materials.

 

I-Tera MT laminate materials are currently being offered in both laminate and prepreg form in typical thicknesses and standard panel sizes. This provides a complete materials solution package for high-speed digital multilayer, hybrid, RF/microwave, multilayer and double sided printed circuit designs. I-Tera MT does not require any special through hole treatments commonly needed when processing PTFE based laminate materials.

 

Key Features

Electrical Properties

     •  Dk: 3.30

     • Df: 0.0036

     • Typical electrical properties over a broad frequency and temperature range per IPC-TM-650-2.5.5.5

 

High Thermal Performance

     • Tg of 200°C  (DMA)

     • Td of 360°C (TGA)

     • Low CTE in the Z-axis 2.8%  (50 to 260°C)

DUPONT™ INTERRA®

DuPont™ Interra® embedded planar capacitor laminate is used to make thinner, more efficient power and ground planes within a multilayer printed wiring board.

It provides very low impedance at high frequency, power bus decoupling, and electromagnetic interference reduction. Interra® HK 04J saves PWB cost by replacing SMT by-pass capacitors, their PTHs and associated costs.

Interra® HK 04J is a rugged polyimide dielectric laminate that can be processed like thin flexible circuit laminate through the develop/etch/strip process steps. The HK 04J dielectric is flexible and can be imaged and etched to remove copper on both sides of the dielectric at the same time. HK 04J provides high reliability through PWB processing and in extreme PWB conditions (eg. the Mars Rover).

 

Features & Benefits

       • Cost reduction by reducing surface mount capacitors, PTHs, and their cost

       • Reduced inductance for efficient low noise power delivery

       • Reduced board size and layer count

       • Improved Routing options

       • Improved PWB reliability and toughness

       • High processing yield

 

Applications

       • High speed multilayer printed wiring boards

       • Servers, routers, telecom

       • Backpanels

       • Miltary and Aerospace PWBs

       • GPUs

       • PWB's with >4 SMT By-Pass Caps per square inch.

 

 

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