---

---

Product Offering

Atotech is one of the world’s leading suppliers of fully integrated process solutions for your advanced PWB fabrication needs from inner-layer bonding through final finishes.

Inner-layer Bonding

BondFilm:  Developed as an alternative to conventional black oxide, BondFilm is Atotech’s simple, economic process for improved iner-layer bonding. As a modified microetch, BondFilm creates an organo-metallic surface that combines the highest degree of iner-layer adhesion with optimized chemical resistance. From its inception, BondFilm was designed as a production system, with chemistry and equipment developed simultaneously. As such, BondFilm addresses the needs of the manufacturer in terms of key functions, such as thinnest material transport, solution delivery and chemistry maintenance. The result is the only truly “package” system for bonding enhancement available in the PWB industry.  More Info...

Secure HTg:  With many advanced materials (such as polyimides, polyphenylene oxides, allylated polyphenylene ethers, cyanate ester/epoxy blends, PTFE, etc.) neither black oxide nor existing oxide replacement systems are suitable. Atotech’s new Secure HTg process offers the comnbined benefits of an intergranular etch combined with a metallic enhancer. Tests have shown  that the synergy of these two systems yields a process that offers all the advantages of both treatment steps – high peel strength (from combined mechanical/chemical bonding), excellent thermal reliability, no pink ring or wedge voids, and ease of processing. The Secure HTg process consists of only three steps – Cleaner, Etch and Enhancer – which can be applied either horizontally or vertically. More Info...

Permanganate Smear Removal

Securiganth P:  Securiganth P represents leading-edge technology for the highest quality smear removal for multilayer circuit boards. Securiganth P features a short three-step process, fast and efficient smear removal and in situ regeneration of the permanganate. Atotech offers both horizontal and vertical options for smear removal. More Info...

Electroless Copper

Noviganth HC Low-build Electroless Copper:  The Noviganth HC low-build electroless copper system offers excellent coverage and adhesion even with the most demanding laminate systems. The process deposits approximately 0.4 microns (16 microinches) in 30 minutes, and is stable and easy to control. Atotech’s unique ionic palladium-organic complex activator deposits much less palladium on the copper than conventional colloidal palladium-tin systems – this means reduced operating costs, less residue on the copper and ultimately, better copper-to-copper adhesion which is critical to today’s high layer count, high performance MLBs. More Info...

Printoganth U Medium-build Electroless Copper:  The Printoganth U medium-build electroless copper offers excellent performance on all common PWB substrates, is stable and easy to control. The process deposits approximately 1.5 microns (60 microinches) in 30 minutes. Atotech’s unique ionic palladium-organic complex activator deposits much less palladium on the copper than conventional colloidal palladium-tin systems – this means reduced operating costs, less residue on the copper and ultimately, better copper-to-copper adhesion which is critical to today’s high layer count, high performance MLBs. More Info...

Direct Plate Technologies

Compact CP and Seleo CP:  With Compact CP and Selio CP the conductive polymer formation in combination with the corresponding pretreatment sequence assures true selectivity –  outstanding copper-to-copper adhesion is the result. Both processes are based on acid through-hole permanganate chemistry whereby permanganate first oxidizes the organic base material, forming insoluble manganese dioxide. The board is then treated with the polyconduct monomer which is oxidized by the manganese dioxide to form a conductive polymer layer. The manganese dioxide, in turn, is reduced to soluble manganese salts and is removed. Compact CP operates horizontally, while Selio CP can be operated either horizontally or vertically. More Info on Selio CP... or More Info on Compact CP...

Neopact:  Direct plating based on colloidal palladium. Neopact is an orfanic-stabilized and palladium-based technology available in both, non-conveyorized (vertical) and conveyorized (horizontal) configurations. The Neopact direct plating process offers the highest quality plating capabilities on all kinds of substrates. Even on Teflon, Neopact produces excellent plating results. The short and easy-to-handle process is based on environmentally friendly chemistry (no chelates, organic solvents or formaldehyde) making Neopact a futre-oriented alternative to the classical PTH process.  More Info...

Panel and Pattern Plating

Cupracid DC Copper Plating:  Atotech offers a wide variety of DC copper plating systems ranging from the exceptionally easy-to-run Cupracid E339 bath (one-component, dye-free system, hull-cell control) to the mirror-bright Curpacid BLCT (two-component dye system) to the high-performance Cupracid HLi bath for plating very high aspect ratio through-holes. 
More Info...

Copper Pulse Plating

Cuprapulse Vertical Copper Pulse Plating:  Atotech’s Cuprapulse pulse plating chemistries employ reverse pulse technology to produce uniform copper deposition in the holes and on the surface over a wide current density range. More Info...

Final Finishes

Aurotech - ENIG:  Aurotech ENIG provides a fully solderable and aluminum wire bondable surface. It deposits a uniform electroless nickel / immersion gold layer over exposed copper surfaces. It provides the planarity and thickness uniformity required for today’s assembly techniques. The Aurotech process offers long life-time for all baths (up to 25+ MTOs for the gold bath with proper maintenance), a low internal stress, high-phosphorous nickel deposit, high selectivity (no background plating on the laminate or soldermask or in non-plated through-holes). 
More Info...

Stannatech – Whisker-free Immersion Tin System:  Based on third generation immersion tin formulations, Stannatech combines perfect bath stability for a 12 month bath life time, with unique soldering performance for multible soldering even after one-year storage. The overall performance of Stannatech meets current and future requirement as an effective alternative to HASL. Stannatech can be run either horizontally or vertically. 
More Info...

Pallatect (PD-Tech) – Electroless Palladium:  PD-Tech is a unique process for the selective deposition of pure palladium. It is designed for both vertical and horizontal plating applications. The absolutely even plating on connecting pads is ideal for SMT. PD-Tech deposits provide excellent solderabilty and constant contact resistance as well as coplanarity. More Info...

Universal Finish SolderBond – A Unique Process for the Deposition of Nickel-Palladium-Gold:  This unique process was developed in response to the industry’s demand for a selective finish that is solderable as well as aluminum and gold wire bondable. In addition, the SolderBond surface is compatible with other interconnection technologies such as conductive adhesives or mechanical contacts. More Info...

---

Company Background

Atotech is one of the world’s leading suppliers of integrated production systems, chemistry and equipment for the PWB industry. The company was formed in 1993 as a result of the merger between M&T Harshaw and Schering Electroplating.

Atotech not only plays a leading role as one of the world’s driving forces in printed circuit production, but Is also among the largest suppliers for the GMF (General Metal Finishing) Industry.

Being part of ATOFINA, a subsidiary of TatalFinaElf, Atotech has access to ATOFINA’s resources in R&D and benefits from production and distribution synergies.

Atotech’s Commitment – “Atotech provides its customers with quality services and products, and strives at all times to offer the best performance for the specific requirements. Attentive to our customers’ needs, we are continuously monitoring, testing and improving our products, services, technology and manufacturing procedures so as to maintain quality, safety and innovation at each stage of the development, production and distribution process.”