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ISOLA: HIGH PERFORMANCE LAMINATES
FR408 High Speed, Low Loss Modified Epoxy
FR408 is a high-performance FR-4 modified epoxy laminate & prepreg system designed for advanced circuit applications. Its low dielectric constant and low dissipation factor make it an ideal candidate for broadband circuit designs requiring faster signal speeds or improved signal integrity. FR408 is compatible with most standard FR-4 processes. This feature allows the use of FR408 without adding complexity to current fabrication techniques.

Performance and Processing Advantages:
  • High Thermal Performance - Tg of 180 degrees C (DSC)
  • Low CTE for reliability
  • Improved Dielectric Properties - DK less than 3.8 (50MHz - 1GHz) - Supports increased signal speeds
  • DF less than 0.010 (50MHz - 1GHz) - Provides better signal integrity
  • UV Blocking and AOI Fluorescence
  • High throughput and accuracy during PBC fabrication and assembly
 Download Brochure PDF more on FR408 >>
 
FR408HR  High Speed, Low Loss Lead-Free Laminate

408HR is a proprietary high performance 230C (DMA) glass transition temperature (Tg) FR-4 system for multilayer printed circuit board (PCB) applications where maximum thermal performance and reliability are required. 408HR laminate and prepreg products are manufactured with Isola's patented high performance multifunctional resin system, reinforced with electrical grade (E-glass) glass fabric. This system delivers a 30% improvement in Z axis expansion and offers 25% more electrical bandwidth (lower loss) than competitive products in this space. When these properties are coupled with its superior moisture resistance at reflow you have a product that bridges the gap from both a thermal and electrical perspective.

  • High Thermal Performance
  • Lead-Free Compatible & RoHS Compliant
  • UV Blocking and AOI Fluorescence
  • Superior Processing
 Download Brochure PDF more on FR408HR >>
 
I-Tera® MT Laminate

I-Tera® MT laminate materials exhibit exceptional electrical properties which are very stable over a broad frequency and temperature range.
I-Tera® MT is suitable for many of today’s high speed digital and RF/microwave printed circuit designs. I-Tera MT features a dielectric constant (Dk) that is stable between -55°C and +125°C up to 20 GHz. In addition, I-Tera MT offers a lower dissipation factor (Df) of 0.0035 making it a cost effective alternative to PTFE and other commercial microwave and high-speed digital laminate materials.

I-Tera MT laminate materials are currently being offered in both laminate and prepreg form in typical thicknesses and standard panel sizes. This provides a complete materials solution package for high-speed digital multilayer, hybrid, RF/microwave, multilayer and double sided printed circuit designs. I-Tera MT does not require any special through hole treatments commonly needed when processing PTFE based laminate materials.

Key Features
Electrical Properties

  • Dk Range: 3.00-3.45
  • Df: 0.0035
  • Typical electrical properties over a broad frequency and temperature range per IPC-TM-650-2.5.5.5
    High Thermal Performance
  • Tg of 200°C (DMA)
  • Td of 360°C (TGA)
  • Low CTE in the Z-axis 2.8% (50 to 260°C)
 Download Brochure PDF more on I-Tera MT >>
 
 
P96 & P26 V-O Polyimide
Isola Laminate Systems offers a product line or polyimide-based prepreg and copper clad laminates for high temperature printed circuit applications. These products consist of a flame resistance, polyimide resin system suitable for military, commercial or industrial electronic applications requiring superior performance and the utmost in thermal properties. They utilize a polyimide and thermoplastic blend resin, fully cured without the use of MDA (Methylene Dianiline). This results in a polymer with a high Tg without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset polyimides.

Performance and Processing Advantages:
  • High Tg - 260 degrees C (TMA)
  • Greater thermal performance over epoxy-bismaleimide blends
  • Maintains Bond Strength at High Temperature
  • Tough Resin System
  • Improved processing due to less brittleness
  • Less delamination from machining
  • Flammability Rating V-0
  • Non-MDA (Methylene Dianiline) Chemistry
  • Meets all OSHA 1910.1050 requirements
 Download Brochure PDF more on P96 & P26 V-O Polimide >>
 
P95 & P25 MDA FREE Polyimide
Isola Laminate Systems offers a product line or polyimide-based prepreg and copper clad laminates for high temperature printed circuit applications. These products consist of a flame resistance, polyimide resin system suitable for military, commercial or industrial electronic applications requiring superior performance and the utmost in thermal properties. They utilize a polyimide and thermoplastic blend resin, fully cured without the use of MDA (Methylene Dianiline). This results in a polymer with a high Tg without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset polyimides.

Performance and Processing Advantages:
  • High Tg - 260 degrees C (TMA)
  • Greater thermal performance over epoxy-bismaleimide blends
  • Maintains Bond Strength at High Temperature
  • Tough Resin System
  • Improved processing due to less brittleness
  • Less delamination from machining
  • Non-brominated Chemistry, Thermally Stable Laminate System
  • Full benefits of 100% polyimide performance
  • Non-MDA (Methylene Dianiline) Chemistry
  • Meets all OSHA 1910.1050 requirements
 Download Brochure PDF more on P95 & P25 MDA FREE Polyimide >>
 
P26N Polyimide Laminate & Prepreg
Isola Laminate Systems offers a product line or polyimide-based prepreg and copper clad laminates for high temperature printed circuit applications. These products consist of a flame resistance, polyimide resin system suitable for military, commercial or industrial electronic applications requiring superior performance and the utmost in thermal properties. They utilize a polyimide and thermoplastic blend resin, fully cured without the use of MDA (Methylene Dianiline). This results in a polymer with a high Tg without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset polyimides.
  • High Tg - 260 degrees C (TMA)
  • Greater thermal performance over epoxy-bismaleimide blends
  • Maintains Bond Strength at High Temperature
  • Tough Resin System
  • Improved processing due to less brittleness
  • Less declamination from machining
  • Flammability Rating V-0
  • Non-MDA (Methylene Dianiline) Chemistry
  • Meets all OSHA 1910.1050 requirements
 Download Brochure PDF more on P26N Polyimid Laminate & Prepreg >>
 
ISpeed
I-Speed is a low loss (DF=0.007), high speed material system. It has a very good thermal performance and thermal stability, with excellent storage life for finished PCB’s.
 
I-Speed laminate and prepreg products are manufactured with Isola’s patent pending high performance multifunctional resin system, reinforced with electrical grade (E-glass) glass fabric. This system delivers a 15% improvement in Z axis expansion and offers 25% more electrical bandwidth (lower loss) than competitive products in this space. When these properties are coupled with its superior moisture resistance at reflow you have a product that bridges the gap from both a thermal and electrical perspective.

Industry Approvals
  • IPC-4101C /21, /24, /121,/124, /129
  • UL Recognized – FR-4, File Number E41625
  • Qualified to UL’s MCIL class with 408. 4115, 408HR family for ease of qualification

High Thermal Performance

  • Tg of 180 (DSC), (Base Laminate)
  • Low CTE for reliability
  • Lead-free Compatible & RoHS Compliant
  • Good performance in Lead Free in MSL testing
  • UV Blocking and AOI Fluorescence

Standard Availability

  •  Thickness: 0.002” ZBC to 0.060″  Available in sheet or panel form
  • Copper Foil Cladding: Grade 3 (HTE), ½, 1 and 2 oz. Foil Options: Reverse treat. eVLP and HVLP (shiny only)
  • Prepregs: Available in roll or panel form
 Download Brochure PDF more on ISpeed >>