| FR408 High Speed, Low Loss Modified Epoxy |
FR408 is a high-performance FR-4 modified epoxy laminate & prepreg system designed for advanced circuit applications. Its low dielectric constant and low dissipation factor make it an ideal candidate for broadband circuit designs requiring faster signal speeds or improved signal integrity. FR408 is compatible with most standard FR-4 processes. This feature allows the use of FR408 without adding complexity to current fabrication techniques.
Performance and Processing Advantages:
- High Thermal Performance - Tg of 180 degrees C (DSC)
- Low CTE for reliability
- Improved Dielectric Properties - DK less than 3.8 (50MHz - 1GHz) - Supports increased signal speeds
- DF less than 0.010 (50MHz - 1GHz) - Provides better signal integrity
- UV Blocking and AOI Fluorescence
- High throughput and accuracy during PBC fabrication and assembly
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| FR408HR High Speed, Low Loss Lead-Free Laminate |
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408HR is a proprietary high performance 230C (DMA) glass transition temperature (Tg) FR-4 system for multilayer printed circuit board (PCB) applications where maximum thermal performance and reliability are required. 408HR laminate and prepreg products are manufactured with Isola's patented high performance multifunctional resin system, reinforced with electrical grade (E-glass) glass fabric. This system delivers a 30% improvement in Z axis expansion and offers 25% more electrical bandwidth (lower loss) than competitive products in this space. When these properties are coupled with its superior moisture resistance at reflow you have a product that bridges the gap from both a thermal and electrical perspective.
- High Thermal Performance
- Lead-Free Compatible & RoHS Compliant
- UV Blocking and AOI Fluorescence
- Superior Processing
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| IS620 High Frequency, Low Loss Epoxy |
IS620 is the first material in the digital-products class built upon existing technologies, yet offering significant advantages for today's digital world. The resin matrix of IS620 is uniquely formulated for high-speed applications ranging from 2 to 10 GHz, providing a low, flat loss response over the entire range.
It is optimal for digital designs and is available in both laminate and prepreg in all typical thickness and standard panel sizes. IS620 offers the designer and fabricators the flexibility of digital design, the assurance of supply, and the ease of conventional FR-4 processing.
IS620 is the first material in its class to offer the complete package of each of the critical items: low loss with a flat response over frequency, availability in both laminate and prepreg form in typical thickness and sizes, and the ability to use conventional fabrication techniques.
Performance and Processing Advantages:
- High Thermal Performance
- Tg of 215 degrees C (DSC)
- Improved Dielectric Properties
- Supports increased signal speeds
- Flat loss response over frequency
- UV Blocking and AOI Fluorescence
- High throughput and accuracy during PBC fabrication and assembly
- PBC Fabrication
- Utilizes conventional FR-4 processes
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| IS680 |
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IS680 laminate materials exhibit exceptional electrical properties which are very stable over a broad frequency and temperature range. IS680 is suitable for many of today's commercial RF/Microwave printed circuit designs. It features a Dielectric Constant (Dk) that is stable between -5is5C and + 125C at up to 20 GHz. In addition, IS680 offers a lower Dissipation factor (Df) of 0.0030 making it a cost effective alternative to PTFE and other commercial microwave laminate materials. IS680 is produced with a tight thickness tolerance, which provides RF/Microwave and high speed digital designers with consistent line impedance. IS680 laminate materials are currently being offered in both laminate and pre-preg form in typical thicknesses and standard panel sizes. This provides a complete materials solution package for RF/Microwave, hybrid multilayer and double sided printed circuit designs. IS680 does not require any special through hole treatments commonly needed when processing PTFE based laminate materials.
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| P96 & P26 V-O Polyimide |
Isola Laminate Systems offers a product line or polyimide-based prepreg and copper clad laminates for high temperature printed circuit applications. These products consist of a flame resistance, polyimide resin system suitable for military, commercial or industrial electronic applications requiring superior performance and the utmost in thermal properties. They utilize a polyimide and thermoplastic blend resin, fully cured without the use of MDA (Methylene Dianiline). This results in a polymer with a high Tg without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset polyimides.
Performance and Processing Advantages:
- High Tg - 260 degrees C (TMA)
- Greater thermal performance over epoxy-bismaleimide blends
- Maintains Bond Strength at High Temperature
- Tough Resin System
- Improved processing due to less brittleness
- Less delamination from machining
- Flammability Rating V-0
- Non-MDA (Methylene Dianiline) Chemistry
- Meets all OSHA 1910.1050 requirements
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| P95 & P25 MDA FREE Polyimide |
Isola Laminate Systems offers a product line or polyimide-based prepreg and copper clad laminates for high temperature printed circuit applications. These products consist of a flame resistance, polyimide resin system suitable for military, commercial or industrial electronic applications requiring superior performance and the utmost in thermal properties. They utilize a polyimide and thermoplastic blend resin, fully cured without the use of MDA (Methylene Dianiline). This results in a polymer with a high Tg without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset polyimides.
Performance and Processing Advantages:
- High Tg - 260 degrees C (TMA)
- Greater thermal performance over epoxy-bismaleimide blends
- Maintains Bond Strength at High Temperature
- Tough Resin System
- Improved processing due to less brittleness
- Less delamination from machining
- Non-brominated Chemistry, Thermally Stable Laminate System
- Full benefits of 100% polyimide performance
- Non-MDA (Methylene Dianiline) Chemistry
- Meets all OSHA 1910.1050 requirements
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| P26N Polyimide Laminate & Prepreg |
Isola Laminate Systems offers a product line or polyimide-based prepreg and copper clad laminates for high temperature printed circuit applications. These products consist of a flame resistance, polyimide resin system suitable for military, commercial or industrial electronic applications requiring superior performance and the utmost in thermal properties. They utilize a polyimide and thermoplastic blend resin, fully cured without the use of MDA (Methylene Dianiline). This results in a polymer with a high Tg without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset polyimides.
- High Tg - 260 degrees C (TMA)
- Greater thermal performance over epoxy-bismaleimide blends
- Maintains Bond Strength at High Temperature
- Tough Resin System
- Improved processing due to less brittleness
- Less declamination from machining
- Flammability Rating V-0
- Non-MDA (Methylene Dianiline) Chemistry
- Meets all OSHA 1910.1050 requirements
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| G200 BT Epoxy |
Isola laminate Systems' G200 is a fully proven laminate and prepreg system designed to meet today's high reliability printed circuit board requirements. Blending bismaleimide/triazine and epoxy resin provides G200 with enhanced thermal, mechanical and electrical performance over most epoxy materials. G200 possesses performance characteristics that make it an excellent selection for large panel size, high layer count printed wiring boards.
Performance and Processing Advantages:
- Hi TG - 185 C (DSC)
- Superior performance through multiple thermal excursions
- Superior Chemical and thermal resistance
- Low CTE from Ambient to 288 C
- Excellent Electrical Insulation in High Humidity and High Temperatures (CAF Resistance)
- Very Consistent Dimensional Stability
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GETEK
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GETEK provides the low dielectric constant (Dk) and low dissipation factor (Df) performance demanded by high speed, low loss printed wiring board (PWB) designs and applications while providing superior thermal performance and high reliability based on the systems 175C glass transition temperature (Tg). GETEK laminate and prepreg products are manufactured using a functionalized, Polyphenylene Oxide/Epoxy resin, reinforced with electrical grade (E-glass) glass fabric. In addition to this superior electrical and thermal performance the mechanical, chemical and low moisture absorption properties all equal or exceed the performance of traditional FR-4 materials. The GETEK system is also UV blocking and fluorescing.
- High Thermal Performance
- Improved Dielectric Properties
- UV Blocking and AOI Fluorescence
- Superior Processing
- Industry Approvals
- Standard Availability
- Copper Foil Cladding
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