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  BROCHURES  

     
 
PACOTHANE* LAMINATION ASSIST
PACOTHANE* Release Materials
PACOTHANE* is a high temperature-resistant Release Film specifically engineered for laminating rigid, flexible and exotic substrate Printed Circuit Boards. It is manufactured in-house under a patented process, with stringent quality controls.
   
FEATURES:
  • Easy, contaminant-free release from resins and separator plates.
  • Proven worldwide performance and acceptance since 1984.
  • Operating temperatures up to 400ŒF / 204ŒC for up to 6 hours.
  • 50% thicker than other release films for easier handling.
  • Smooth surface finish, with superior conformal properties.
  • Free of embedded impurities.
  • Extremely low X-Y axis shrinkage and reduced static potential.
  • Essentially inert: no out-gassing, no plate residue, no interlaminar adhesion influence, and no vacuum system contamination.
  • Environmentally friendly: no Ozone Depleting Chemicals, no Flourines.
  • Available in custom-sized tooled sheets and rolls shipped Just-in-Time from exclusive local Distributors around the world.
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PACOPADS* Press Pads
PACOPADS* are a line of press pads specifically engineered to improve the process of laminating rigid multi-layer and flexible Printed Circuit Boards. They serve two primary functions: to accurately Control heat input and to Equalize the pressure applied to the panel surface.
   
LAMINATION PROCESS ADVANTAGES:
   
  • Control of Heat Rise
  • PACOPADS perform this function with totally predictable and reproducible results due to their uniform fiber distribution and tightly controlled thickness and weight specifications.
  • Equalization of Pressure Throughout the Pressure Load
  • Use of PACOPADS eliminates air voids, inner-layer slippage and White corners or edges. PACOPADS also reduce dielectric thickness variations, image and glass cloth transfer, and obviate the potential of low-pressure prepreg blisters.
  • 3-Dimensional Conformance
  • PACOPADS eliminate X-Y-Z axis stresses which cause Cover-layer voids and circuit distortion. At the same time, PACOPADS improve cavity fill, and adhesive flow control in the manufacture of Flex, Rigid-flex, and Heat Sink Circuit Boards.
     
FEATURES:
  • Proven worldwide performance since 1986.
  • Operating temperature of 475°F/246°C for six hours.
  • Three standard thicknesses of .035" (.89mm), .055" (1.4mm), and .085" (2.2mm) for custom Heat Input Control and optimal Pressure Equalization.
  • Extremely low moisture to reduce liquid buildup in vacuum systems.
  • Uniform fiber formation and distribution for unmatched pressure equalization, micro Z-axis conformance and repeatable, consistent Heat Rise.
  • Low fiber dusting and contamination.
  • No resinous binders or fillers, essentially sulfur free, with no odor or solvents to pollute vacuum systems or the work environment.
  • Environmentally friendly – suitable for re-pulping, land fill disposal or incineration.
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PACOGARD*
PACOGARD* Panel Separator or "Slip" Sheets are a line of proprietary, process-enhancement products specifically engineered to protect both Inner & Outerlayer PCB Panels from scrap resulting from handling Damage, excessive Oxidation and Airborne Particulates. PACOGARD also significantly reduces "False Alarms" at AOI.
     
COST-SAVING BENEFITS OF PANEL INTERLEAVING:
   
  • Quantifiable reduction of “False Alarms“ at AOI due to Handling Damage and surface Particulates
  • Reduction of Handling Scratches, Dents, And Electrical Opens due to panel movement
  • Dramatic slowdown of Surface Oxidation [a cause of poor adhesion of Photoresist, Metal Plating, and Solder Mask] increases “hold times" significantly.
  • Protects panel surfaces from airborne prepreg Dust, Fibers, and destructive Fumes.
     
FEATURES:
   
  • Clean, fiber-free, inert, releasable surfaces are color-coded to eliminate cross-area Process Contamination.
  • Clad on both sides with a polymeric barrier coating that is both chemical and moisture resistant, can withstand moisture-relief baking temperatures [250°F/121°C].
  • Negative static potential and a low Coefficient of Friction to prevent cosmetic abrasion of sensitive copper and oxided surfaces.
  • Built-in durability to provide multiple reuse.
 
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PACO•VIA*
The PACO•VIA Two-Component System (PACO•VIA and PACOPADS) is a performance-driven line of High-Temperature, Resin- Blocking Release Films. The PACO•VIA System is specifically engineered to enhance sequential lamination of Buried and Blind Via designed rigid printed Circuit Boards.
   
LAMINATION PROCESS ADVANTAGES:   

  • Resin Containment
  • PACO•VIA Resin Blocking Film contains the resin within the via barrel eliminating the need for secondary processing to remove cured resin from the panel surface.
  • Barrel Fill
  • PACO•VIA Resin Blocking Film allows the liquid resin to essentially fill the via Barrel.
  • Contain Resin Squeeze-out
  • PACO•VIA contains resin squeeze-out like traditional release films while offering superior copper surface buffering from damaged Separator Plates.
  • Equalization of Pressure Throughout the Pressure Load
  • The PACOPADS component of the PACO•VIA System ensures complete barrel fill, and controlled Dielectric Thickness. PACOPADS eliminate air voids, inner-layer slippage and white corners or edges. PACOPADS also reduce image and glass cloth Transfer, and alleviate the potential of low-pressure prepreg Blisters. See PACOPADS Product Information Bulletin.
     
FEATURES:
   
  • Three engineered Grades to fit all sequential lamination demands.
  • Choice of PACOPADS Pressure Equalizing Press Pads designed to suit all lamination process parameters.
  • Operating temperature of 425°F / 218°C for up to 4 hours.
  • Proven worldwide performance since 1996.
  • Essentially inert, no out-gassing, plate residue, interlaminate adhesion influence, no vacuum system contamination.
  • Environmentally friendly: no chrome-depleting chemicals, no Flourines.
 
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PACOTHANE Plus*
Pacothane Plus is a conformable Release Sheet that is specifically engineered for use as a component of the Pacothane Plus System for the production of flexible Printed Circuits (base stock, coverlay, and rigid-flex). Pacothane Plus brings standardization and predictability to the flex laminating process and offers tangible process advantages.
   
LAMINATION PROCESS ADVANTAGES:
  • Tight Coverlay Conformity
  • PACOTHANE PLUS delivers discreet, micro-applied, hydraulic force necessary to drive laminate Components into tight conformity. It mirrors the part topography to eliminate air entrapment under the Coverlay, between Circuits, and assures excellent circuit side-wall Adhesion.
  • Reduces Mechanical Distortion
  • PACOTHANE PLUS "locks in" around the laminate components to minimize distortion due to Heat and Pressure. In conjunction with PACOPADS, the PACOPLUS System conforms in the Z axis only, eliminating the X-Y axis distortion associated with commodity conformals.
  • Control of Adhesive Flow
  • PACOTHANE PLUS effectively dams back acrylic or epoxy adhesive flow into pre-drilled or punched openings, as well as at rigid-flex interfaces.
  • Quick Easy Release
  • Both sides of PACOTHANE PLUS provide quick, easy, and clean release from all surfaces.
  • Reduced Lamination Pressure
  • The PACOPLUS System, consisting of PACOTHANE PLUS Conformable Release Sheet and PACOPADS Pressure Diffuser Press Pads, discreetly conforms in the Z axis while equally distributing pressure across the panel surface. Due to the superior, macropressure-equalizing characteristics of PACOPADS, the same amount of hydraulic force is delivered with a lower nominal Ram Pressure.
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PACOFLEX #5000 
PACOFLEX #5000 is an adhesive & resin blocking, Conformable Release Film. It is specifically engineered for the Lamination of Cover-Layers to Flexible Printed Circuit Boards. This product is a highly Conformable Release Film which, when exposed to heat and pressure, becomes extremely soft and pliable for superior conformance to intricate flex part topographies. The soft, heat-activatable, Hydraulic center is application-designed to reduce excessive "squeeze-out" and, effectively blocks adhesive or resin flow into unwanted areas.
  • Two-side Releasable.
  • Engineered Conformance layer that prevents uncontrolled "squeeze-out".
  • Ultra Smooth Surface Finish for superior Adhesive Flow Control.
  • Extremely low X-Y axis movement.
  • Clean, inert with no out-gassing of contaminants or solvents harmful to Vacuum systems.
  • Operating temperature to 400°F/204°C with reduced Ram Pressures.
  • Environmentally friendly with no ozone-depleting Chemicals or Flourines.
  • Suitable for incinerator or landfill.
  • Proven worldwide products since 1985.
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