TW-YE style of foil is an improved single side treated electro-deposited copper foil, characterized by enhanced high temperature elongation properties [IPC-Grade 3] and thermally stable microstructure. With the inorganic YE protection on the shiny surface, the foil shows superior resistance to oxidation in warm and humid environments. Excellent adhesion to a broad range of substrates allows it to be used for the fabrication of laminates for rigid, composite and conventional multilayer / mass lamination applications.
TWS represents a family of high performance single-sided treated products designed to provide high bond strength on wide range of high Tg substrates and new engineering plastics. The base foil is characterized by enhanced high temperature enlongation properties [IPC-Grade 3] and thermally stable microstructure. The product is designed for the manufacture of high performance laminates with extended thermal stability and electrical properties.
Typical substrates include polyimide and bismaleimidetriazine (BT) epoxy blends, cyanate esters, hydrocarbon-ceramics and fluorocarbon materials.
Matte side treated and with high temperature elongation properties
For a wide range of high TG substrates
Used for microwave applications and on various thermoplastic materials
Exists also in a reverse treated version ( TWS-B )
TW-LP4-YE represents a family of advanced single-sided treated products based on a unique low profile matte side base foil. The final product, after application of bonding treatment to this matte surface, exhibits Very Low Profile characteristics. The inorganic YE protection on the shiny foil surface ensures its superior resistance to oxidation in warm and humid environments. The product is designed for the manufacture of ultra thin innerlayer FR-4 based laminates for multilayer PCB manufacture. These laminates will be used to produce high density, fine line or controlled impedance PCB circuitry.
Derived versions like LPT are used for chip or smart card modules.
Matte side treated and high temperature elongation properties
Very low profile treatment with Rz of 4 - 5µm
For thin laminates ( 50µ - 100µ )
High speed controlled impedance boards
Fast and precise etching behavior
Special foil for smart card and antenna applications ( LPT )
Organic free, anti-tarnish passivation
Special foil for smart and antenna cards
TAB applications
Very low profile roughness
fast and precise fine line etching
very suitable topography for wire bonding
High tensile and yield strength after thermal treatments
maintains perfect flatness for flip chip applications
HFI represents a family of advanced single-sided treated products designed to provide high bond strength on a wide range of high Tg, low dielectric constant substrates and new engineering plastics. A pure copper treatment limits negative effects on PIM. This standard profile product (thickness range: ≥ 70 μm) is designed for the manufacture of high performance laminates with extended thermal stability and electrical properties designated for very high frequency circuitry operate at ultra high frequencies often in hostile or remote locations where long term reliability and stability is of crucial importance.
Matte side treated and with high temperature elongation properties
Circuit Foil's Doublethin* products are designed for very fine line circuits and for μBGA and Chip Scale Packaging applications. The ability to produce ultra fine line circuitry using conventional subtractive technology is primarily limited by etching capability. As line-to-track spacing fall, the ability to accurately replicate well defined line and pad features, rapidly degrades.
A solution to these limitations derives from semi-additive techniques using substrates clad with ultra thin 5 μm to 9 μm functional copper layers and conventional copper build-up followed by differential "flash etching." Ultra thin foils can also be directly laser-drilled, providing a direct entry into high-end buried and blind via interconnectivity arena through sequential build-up techniques.
BF style of foil is an ultra flat single side treated electro-deposited copper foil, characterized by high ductility at room temperature and a fine grain size with thermally stable microstructure. Combined with our inorganic YE surface protection, the foil shows superior resistance to oxidation in warm and humid environments. The zinc-free copper HFI treatment is designed to provide good bond strength on substrates and limits negative effects on Passive Intermodulation. Typical substrates include PTFE for HF low loss application up to 40 GHz.
Ultra flat ED copper foil extreme fine grain structure
High temperature elongation properties
Special fine pitch treatments (Rz below 4µm)
Fast and precise etching behavior
For ultra thin laminates or high speed controlled impedance boards
Available with zinc-free treatment
Very high flexural fatigue for dynamic flex applications
BF style of foil is an ultra flat single side treated electro-deposited copper foil, characterized by high ductility at room temperature and excellent flexible properties [IPC-Grade 10] and a fine grain size with thermally stable microstructure. The very uniform pink TO copper treatment is designed to provide excellent bind strength on flexible substrates. Typical substrates include FPC (PI, PET, PEN) and PTFE for HF low loss application up to 40 GHz.
Ultra flat ED copper foil extreme grain structure
High temperature elongation properties
Special fine pitch treatments (Rz below 4µm)
Fast and precise etching behavior
Zinc-free, pink treatment
Isotropic characteristics
Available down to 9µ
Very high flexural fatigue for dynamic flex applications
TOF is an improved single side Zinc free treated electro-deposited copper foil, characterized by enhanced high temperature elongation properties [Grade 3] and ductility at room temperature [Grade 2] and designed to provide high bond strength on a wide range of substrates including polyimide and polyester based flexible laminates used in static applications. The high fatigue ductility provides optimum performance in static flax applications. The high fatigue ductility provides optimum performance in static flex applications. The physical and chemical adhesion of the nodular TOF treatment assures high bond and rapid etching behavior.
This Resin Coated Copper Foil is designed for microvia board production as required by cellular phones or base stations. The high TG epoxy resin system has a superior flexibility for easy handling during the lay-up and provides a perfect and regular insulation thickness after lamination. Accurate coating thicknesses, combined with adjusted resin flow characteristics provide excellent hole filling and microvia quality. The foil can be laminated in a conventional vacuum or any ADARA* press and doesn't require necessarily pin lamination. The resin system is easily laser-ablated or plasma-etched. Combined with the use of copper carrier supported ultra thin Doublethin* foils, optimum protection of the functional 5
µm layer is achieved, resulting in excellent yield figures. In tandem with ultra-thin copper foils, Laser Direct Drilling with a CO2
laser can be applied.
Resin coated copper foil for microvias
Modified high TG FR4 resin
TG > 150 °C per DSC
Coating thickness ranging from 10 µ to 100 µ
Very accurate thickness control
Available in rolls with uncoated edges for ADARA™ press technology or in sheets with or without punched registration holes
This Halogen Free Resin Coated Copper Foil is designed for sequential build-up manufacture of microvia boards for environmentally friendly "green PCBs." The high TG epoxy resin system provides a perfect and regular insulation thickness after lamination. Its resin's ideal flow behavior provides excellent hole filling and microvia quality. Lead-free solders currently being used and developed for printed circuit assembly require higher processing temperatures that can degrade the base material commonly used in printed circuits, results in decreased long-term reliability. The epoxy Novolac Resin Coated Copper Foil has been specially designed to withstand such higher temperatures. The foil can be laminated in a conventional vacuum or any ADARA* press and doesn't require necessarily pin lamination. The resin system is easily laser-ablated. Combined with the use of copper carrier supported ultra thin Doublethin* foils, optimum protection of the functional 5 µm layer is achieved, resulting in excellent yield figures.
Halogen free resin coated copper for microvias
Copper thickness from 5µ to 70µ
Very low profile treatment LP4 and HTE foils
Newest coating equipment with air floatation dryer
Accurate resin thickness from 10µ to 100µ
Available in rolls with uncoated edges for ADARA™ press technology or in sheets with or without punched registration holes
Lead-free solders currently being used and developed for printed circuit assembly require higher processing temperatures that can degrade the base materials commonly used in printed circuits, resulting in decreased long-term reliability. This Epoxy Novolac Resin Coated Copper Foil has been specially designed to withstand such higher temperatures. Accurate coating thickness, combined with adjusted resin flow characteristics provide excellent hole filling and microvia quality. The foil can be laminated in a conventional vacuum or any ADARA* press and doesn't require necessarily pin lamination. The resin system is easily laser-ablated. Combined with the use of copper carrier supported ultra thin Doublethin foils, optimum protection of the functional 5 µm layer is achieved, resulting in excellent yield figures.
Resin coated copper foil for microvias
Modified high TG FR4 resin
TG > 150 °C per DSC
Coating thickness ranging from 10 µ to 150 µ
Very accurate thickness control
Available in rolls with uncoated edges for ADARA™ press technology or in sheets with or without punched registration holes
This Resin Coated Copper Foil is designed to improve the overall cosmetic and functional properties of the external circuitry. A thin, high TG resin film acts as additional dielectric spacer and helps for an easier handling of thin foils without carrier. A significant reduction of the top waviness in typical glass fabric styles is achieved allowing a better photo definition of the external circuitry.
For relamination of thin copper foils on external planes
Designed to improve the overall cosmetic and functional properties
Strongly reduces the top waviness for an improved photo definition
The thin, high TG resin films acts as dielectric spacer
Higher yield for electrical rejects
Helps for an easier handling
Available on very low profile, on reverse treated and ultra flat foils
BF is an ultra flat electrodeposited copper foil without any additional bondning treatment. This foil is characterized by an extremely fine grain structure and superior mechanical properties which ensure excellent bendability in either direction. Its exceptionally low profile makes it very suitable for Lithium-ion batteries where a Graphitic carbon is bonded to the copper foil in order to form the current collector. The very thin BF-Plainstainproof foils are widely used in all kinds of Lithium-ion batteries for notebooks, PDA's, and mobile phones. It is an ideal solution for large size and high power batteries as required by Hybrid Electrical Vehicles (HEV).
ultra flat ED copper foil
3extreme fine grain structure
3high temperature elongation and superior mechanical properties
TW-B style of foil is an advanced single-sided treated electro-deposited copper foil, where bonding treatment is applied to the "shiny" side (so-called "Reverse Treated Foil"). The final product exhibits Very Low Profile characteristics for the treatment side. Base foil is characterized by enhanced high temperature elongation properties [Grade 3]. This foil is now also available with the inorganic YE protection on the untreated matte surface, assures superior resistance to oxidation, especially in warm and humid environments. The product is designed for the manufacture of FR-4 based laminates for multilayer PBC's, where inner layers will be submitted to "oxide-bonding" chemistries. Such cores will be used to produce high density, fine line or controlled impedance PCB circuitry.
Treated on the shiny side
High temperature elongation
Very low profile treatment on the shiny side of the foil ( Rz : 4 to 4.5 µ )
No specific chemical microetch prior photo-process
High inner laminate bond due to untreated matte side profile
NT Stainproofing
Also available as thicker foils from 105 µ to 210 µ
TWS-B style of foil is a high performance single-sided treated electro-deposited copper foil, where bonding treatment is applied to the "shiny" side (so-called "Reverse Treated Foil"). This products is designed to provide high bond strength on a wide range of high Tg substrates and new engineering plastics. Base foil is characterized by enhanced high temperature elongation properties [Grade 3]. This foil is now available with the inorganic YE protection on the untreated matte surface, assures superior resistance to oxidation, especially in warm and humid environments. The product is designed for the of high performance laminates with extended thermal stability and electrical properties for multilayer PCB's where inner layers will be submitted to "oxide-bonding" chemistries. Typical substrates include polyimide and bismaleimidetriazine (BT) epoxy blends and cyanate esters.
Treated on the shiny side
High temperature elongation
Very low profile treatment on the shiny side of the foil
Enhanced bond strength on high TG and filled systems
No specific chemical microetch prior photo-process
High inner laminate bond due to untreated matte side
HFI-B represents a so-called "RTF - Reverse Side Treated Foil," where bonding treatment is applied to the "shiny" side. The final product exhibits Very Low Profile characteristics for the treatment side. Base foils characterized by enhanced high temperature elongation properties [Grade 3]. Its Zinc free HFI treatment provides high bond strength on a wide range of high Tg, log dielectric constant substrates and new engineering plastics. A pure copper treatment limits negative effects on PIM*. The product is designed for the manufacture of high performance laminates with extended thermal stability and electrical properties designated for very high frequency circuitry applications, as for RF antennas and wireless devices. PCB's manufactured with such laminates may be designed to operate at ultra high frequencies often in hostile remote locations where long term reliability and stability is of crucial importance.
Additional alternatives for ultra high frequencies (> 40 GHz) are our extremely smooth BF based foils with HFI treatment.
Drum side treated and with high temperature elongation properties
With a zinc free treatment for superior PIM
Designed for PTFE based laminates
Exists also in a matte side version (HFI and HFI-LP)
