370HR is a high Tg, high Td 180C glass transition temperature (Tg) FR-4 system for multilayer printed wiring board (PWB) applications where maximum thermal performance and reliability are required. 370HR laminate and prepreg products are manufactured with a unique high performance multifunctional epoxy resin, reinforced with electrical grade (E-glass) glass fabric. This system provides improved thermal performance and low expansion rates in comparison to traditional FR-4 while retaining FR-4 processability. In addition to this superior thermal performance the mechanical, chemical and moisture resistance properties all equal or exceed the performance of traditional FR-4 materials. The 370HR system is also laser fluorescing and UV blocking for maximum compatibility with automated optical inspection systems (AOI), optical positioning systems and photoimageable soldermask imaging.

• High Tg - 170 degrees C (DSC)Superior performance through multiple thermal excursions
• Superior thermal resistance for lead-free processing
• Lower CTE from ambient to 288 degrees C
• Ultraviolet (UV) Blocking & AOI Compatible UV blocking and enhanced florescence
• Laser enhanced reflectance compatible will all AOI equipment
• Standard FR-4 Processing
• No post bake after pressing.
• Drilling parameters and hole wall preparation are standard

IS410 is a high-performance FR-4 epoxy laminate & prepreg system designed to support the printed circuit board industry's requirements for higher levels of reliability and the trend to lead-free solder.

Isola's IS410 has a Tg of 180 degrees C and is specially formulated for superior performance through multiple thermal excursions, passing 6X solder tests at 288 degrees C. IS410 is optimized for enhanced drilling performance allowing high aspect ratio holes of less than or equal to 10 mils. Its unique resin chemistry provides CAF resistance with the benefit of long-term reliability of boards built with small feature designs. Along with these attributes, IS410 brings improved productivity with its fast cure system while using current fabrication techniques.

• IS410 is especially suited for broadband, networking equipment
• Performance and Processing Advantages
• High Thermal Performance
• Tg of 180 degrees C (DSC)
• Superior performance through multiple thermal excursions -Passes 6X @ 288 degrees C
• Fast Cure
• Unique chemistry increases throughput with reduced press time
• CAF Resistant
• Supports small feature size pcb designs
• Improves long-term circuit board reliability in the field
• Enhanced Drilling Performance for High Aspect PTH
• Greater than 10 to 1 aspect ratio
• Optimized for drilling small holes (less than 10 mils)