IPC Thermal Conference
November 3-4, 2010 — Irvine, CA
3:00 pm–5:00 pm

PCB Material Options and Properties Relative to Thermal Management
Designing for thermal management requires a thorough understanding of the materials available today. There are many different materials for thermal management PCB fabrication and they vary in thermal performance, electrical performance, and cost. Some designs may require high performance thermal materials; others may be able to utilize a more standard and economical option. This workshop will cover

• Standard and lead free compatible dielectrics (prepregs)
• Epoxy and polyimide films
• Metallic substrates (copper and aluminum)
• Formulas to help calculate which materials are necessary for your design
• Thermal and electrical characteristics as well as cost considerations
• How your material selection affects reliability of the components in your design

About the Instructors

Chris Hunrath has 28 years experience in the PCB industry starting in PCB manufacturing. The last 17 years has been in chemistry and materials supply. Chris is currently the technical director for Integral Technology, a developer of new materials for the PCB industry.

Terry Staskowicz has been involved in the PCB industry for 14 years. He has held various positions including operator, R&D technician to process engineering. For the last five years, he has been a technical account manager for Insulectro. He is also involved market research and development of thermal management materials in partnership with Integral Technologies.